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CQ-TCL63C07
Thermal Module is a developed based on latest uncooled and cooled infrared technology.
It adopts advanced digit circuit and imaging processing algorithm.
The uncooled network thermal imaging movement has an area array size of 640×512 / 1280x1024 vanadium oxide detectors, compatible with a variety of infrared lenses.
Model | CQ-TCL63C07 |
Sensor | Uncooled FPA Vox |
Spectral Range | 8μm~14μm |
Resolution | 640x512, 12μm |
Focal Length | 25~75mm |
F | F1.0~F1.1 |
Size | φ95mm×185mm |
Weight | ≤1kg |
Thermal Module is a developed based on latest uncooled and cooled infrared technology.
It adopts advanced digit circuit and imaging processing algorithm.
The uncooled network thermal imaging movement has an area array size of 640×512 / 1280x1024 vanadium oxide detectors, compatible with a variety of infrared lenses.
Model | CQ-TCL63C07 |
Sensor | Uncooled FPA Vox |
Spectral Range | 8μm~14μm |
Resolution | 640x512, 12μm |
Focal Length | 25~75mm |
F | F1.0~F1.1 |
Size | φ95mm×185mm |
Weight | ≤1kg |
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Fax:+86-571-8791 8750
E-mail:sales@hzcqtech.com
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